Invention Grant
- Patent Title: EUV lithography system with diffraction optics
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Application No.: US17062558Application Date: 2020-10-03
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Publication No.: US11520235B2Publication Date: 2022-12-06
- Inventor: Kenneth Carlisle Johnson
- Applicant: Kenneth Carlisle Johnson
- Applicant Address: US CA Santa Clara
- Assignee: Kenneth Carlisle Johnson
- Current Assignee: Kenneth Carlisle Johnson
- Current Assignee Address: US CA Santa Clara
- Main IPC: G03F7/20
- IPC: G03F7/20 ; G02B5/18 ; G02B17/08 ; G02B26/08 ; G02B27/42

Abstract:
A maskless, extreme ultraviolet (EUV) lithography scanner uses an array of microlenses, such as binary-optic, zone-plate lenses, to focus EUV radiation onto an array of focus spots (e.g. about 2 million spots), which are imaged through projection optics (e.g., two EUV mirrors) onto a writing surface (e.g., at 6× reduction, numerical aperture 0.55). The surface is scanned while the spots are modulated to form a high-resolution, digitally synthesized exposure image. The projection system includes a diffractive mirror, which operates in combination with the microlenses to achieve point imaging performance substantially free of geometric and chromatic aberration. Similarly, a holographic EUV lithography stepper can use a diffractive photomask in conjunction with a diffractive projection mirror to achieve substantially aberration-free, full-field imaging performance for high-throughput, mask-projection lithography. Maskless and holographic EUV lithography can both be implemented at the industry-standard 13.5-nm wavelength, and could potentially be adapted for operation at a 6.7-nm wavelength.
Public/Granted literature
- US20220107568A1 EUV Lithography System with Diffraction Optics Public/Granted day:2022-04-07
Information query
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