Invention Grant
- Patent Title: Three-dimensional sensing module and method of manufacturing the same and electronic apparatus
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Application No.: US17011108Application Date: 2020-09-03
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Publication No.: US11520429B2Publication Date: 2022-12-06
- Inventor: Lien Hsin Lee , Ren Hung Wang , Cai Jin Ye , Wei Yi Lin , Tai Shih Cheng , Tsai Kuei Wei , Chih Cheng Chuang , Sun Po Lin
- Applicant: TPK Advanced Solutions Inc.
- Applicant Address: CN Fujian
- Assignee: TPK Advanced Solutions Inc.
- Current Assignee: TPK Advanced Solutions Inc.
- Current Assignee Address: CN Fujian
- Agency: Cooper Legal Group, LLC
- Main IPC: G06F3/041
- IPC: G06F3/041 ; G01L1/22 ; G01L1/20

Abstract:
A three-dimensional sensing module includes a touch pressure sensing structure. The touch pressure sensing structure includes a first functional spacer layer, a first light-transmitting electrode layer coated on the first functional spacer layer, a second functional spacer layer coated on the first light-transmitting electrode layer, a second light-transmitting electrode layer coated on the second functional spacer layer, and a third functional spacer layer coated on the second light-transmitting electrode layer. Resistivities of the first, second, and third functional spacer layers are greater than resistivities of the first and second light-transmitting electrode layers.
Public/Granted literature
- US20220066608A1 THREE-DIMENSIONAL SENSING MODULE AND METHOD OF MANUFACTURING THE SAME AND ELECTRONIC APPARATUS Public/Granted day:2022-03-03
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