Invention Grant
- Patent Title: Fast multipath failover
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Application No.: US16775892Application Date: 2020-01-29
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Publication No.: US11520671B2Publication Date: 2022-12-06
- Inventor: Ashwin Tidke , Venkatesh Doddamane Nagaraj , Kurumurthy Gokam
- Applicant: EMC IP Holding Company LLC
- Applicant Address: US MA Hopkinton
- Assignee: EMC IP Holding Company LLC
- Current Assignee: EMC IP Holding Company LLC
- Current Assignee Address: US MA Hopkinton
- Agency: Ryan, Mason & Lewis, LLP
- Main IPC: G06F11/00
- IPC: G06F11/00 ; G06F11/20 ; G06F11/07 ; G06F3/06

Abstract:
A host device is configured to obtain a default timeout value of the host device for the submission of an input-output (IO) operation to a storage system and to determine a first timeout value that is less than the default timeout value. The host device is further configured to submit the IO operation to the storage system along a first path using the first timeout value and to determine that the submission of the IO operation along the first path has timed out. The host device is further configured to determine a second timeout value that is greater than the first timeout value and to submit the IO operation to the storage system along a second path using the second timeout value.
Public/Granted literature
- US20210232468A1 FAST MULTIPATH FAILOVER Public/Granted day:2021-07-29
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