Embodiments of the present disclosure include techniques for transferring non-power of two (2) bytes of data between modules of an integrated circuit over an on-chip communication fabric. In one embodiment, the present disclosure includes an on-chip communication fabric, a first module comprising an interface coupled to the fabric having a first data width, and a second module comprising an interface coupled to the fabric having a second data width smaller than the first data width. The non-power of two (2) bytes of data are sent between the first and second modules through the fabric, and the fabric maps the non-power of two (2) bytes of data between the first and second data widths.