Invention Grant
- Patent Title: Data transfer system, circuit, and method
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Application No.: US17218209Application Date: 2021-03-31
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Publication No.: US11520730B2Publication Date: 2022-12-06
- Inventor: Po-Lin Wei , Pi-Ming Lee , Chih-Chiang Yang
- Applicant: REALTEK SEMICONDUCTOR CORPORATION
- Applicant Address: TW Hsinchu
- Assignee: REALTEK SEMICONDUCTOR CORPORATION
- Current Assignee: REALTEK SEMICONDUCTOR CORPORATION
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, PC
- Priority: TW109111815 20200408
- Main IPC: G06F15/173
- IPC: G06F15/173 ; G06F9/54 ; G06F5/12 ; G06F15/78

Abstract:
Disclosed is a data transfer system capable of accelerating data transmission between two chips. The data transfer system includes: a master system-on-a-chip (SoC) including a master transmission circular buffer and a master reception circular buffer; and a slave SoC including a slave reception circular buffer and a slave transmission circular buffer. The slave/master reception circular buffer is a duplicate of the master/slave transmission circular buffer; accordingly, the write pointers of the two corresponding buffers are substantially synchronous and the read pointers of the two corresponding buffers are substantially synchronous as well. In light of the above, the read and write operations of the master/slave transmission circular buffer can be treated as the read and write operations of the slave/master reception circular buffer; therefore some conventional data reproducing procedure(s) for the data transmission can be omitted and the data transmission is accelerated.
Public/Granted literature
- US20210318982A1 Data transfer system, circuit, and method Public/Granted day:2021-10-14
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