Invention Grant
- Patent Title: Write circuit of memory device
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Application No.: US17229676Application Date: 2021-04-13
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Publication No.: US11521662B2Publication Date: 2022-12-06
- Inventor: Xiu-Li Yang , Kuan Cheng , He-Zhou Wan , Wei-Yang Jiang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. , TSMC CHINA COMPANY LIMITED
- Applicant Address: TW Hsinchu; CN Shanghai
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.,TSMC CHINA COMPANY LIMITED
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.,TSMC CHINA COMPANY LIMITED
- Current Assignee Address: TW Hsinchu; CN Shanghai
- Agency: Maschoff Brennan
- Priority: CN202011311981.3 20201120
- Main IPC: G11C8/00
- IPC: G11C8/00 ; G11C7/22 ; G11C5/06 ; G11C7/10

Abstract:
A device includes memory banks, a first pair of write data wirings, a second pair of write data wirings and a global write circuit. The first pair of write data wirings is connected to a first group among the memory banks. The second pair of write data wirings is connected to a second group among the memory banks. In response to a first clock signal, the global write circuit generates a first global write signal and a first complement global write signal transmitted to the first group among the memory banks through the first pair of write data wirings. In response to a second clock signal, the global write circuit generates a second global write signal and a second complement global write signal transmitted to the second group among the memory banks through the second pair of write data wirings.
Public/Granted literature
- US20220165319A1 WRITE CIRCUIT OF MEMORY DEVICE Public/Granted day:2022-05-26
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