Invention Grant
- Patent Title: Coil component
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Application No.: US16365093Application Date: 2019-03-26
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Publication No.: US11521790B2Publication Date: 2022-12-06
- Inventor: Jeong Gu Yeo , Byeong Cheol Moon
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2018-0094505 20180813
- Main IPC: H01F27/32
- IPC: H01F27/32 ; H01F27/28 ; H01F27/24 ; H01F27/29

Abstract:
A coil component includes a body and external electrodes. The body includes a support member having through-openings formed in end portions thereof, an internal coil supported by the support member, and an encapsulant encapsulating the support member and the internal coil. The through-openings are filled with end portions of the internal coil. An insulating layer is interposed between the internal coil and the external electrode.
Public/Granted literature
- US20200051735A1 COIL COMPONENT Public/Granted day:2020-02-13
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