In a method for increasing the electrical functionality, and/or service life, of power electronic modules, the power electronic circuit carrier, and/or the metallisation applied onto the power electronic circuit carrier, and/or a base plate connected, or to be connected, to a rear face of the power electronic circuit carrier, is finely structured by means of local material removal with at least one laser beam, so as to reduce thermomechanical stresses occurring during the production or operation of the module. In an alternative form of embodiment, the metallisation applied onto the front face of the power electronic circuit carrier is structured, or an already created structure is refined or supplemented, by means of local material removal with laser radiation, so as to achieve a prescribed electrical functionality of the metallisation.