Invention Grant
- Patent Title: Semiconductor device having component mounted on connection bar and lead on top side of lead frame and method of manufacturing semiconductor device thereof
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Application No.: US16504917Application Date: 2019-07-08
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Publication No.: US11521918B2Publication Date: 2022-12-06
- Inventor: Hyung Jun Cho , Kyoung Yeon Lee , Tae Yong Lee , Jae Min Bae
- Applicant: Amkor Technology Singapore Holding Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: Amkor Technology Singapore Holding Pte. Ltd.
- Current Assignee: Amkor Technology Singapore Holding Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Spectrum IP Law Group LLC
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/48 ; H01L21/56 ; H01L23/31 ; H01L23/498
Abstract:
In one example, a semiconductor device comprises a substrate and an electronic device on a top side of the substrate, a lead frame on the top side of the substrate over the electronic device, wherein the lead frame comprises a connection bar and a lead, a component mounted to the connection bar and the lead on a top side of the lead frame, and an encapsulant on the top side of the substrate, wherein the encapsulant contacts a side of the electronic device and a side of the component. Other examples and related methods are also disclosed herein.
Public/Granted literature
- US20210013136A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2021-01-14
Information query
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