Invention Grant
- Patent Title: Semiconductor device with fuse and anti-fuse structures and method for forming the same
-
Application No.: US16950518Application Date: 2020-11-17
-
Publication No.: US11521924B2Publication Date: 2022-12-06
- Inventor: Chin-Ling Huang
- Applicant: NANYA TECHNOLOGY CORPORATION
- Applicant Address: TW New Taipei
- Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee Address: TW New Taipei
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H01L23/525
- IPC: H01L23/525 ; H01L23/532 ; H01L21/768

Abstract:
The present disclosure provides a semiconductor device with a fuse structure and an anti-fuse structure and a method for forming the semiconductor device. The semiconductor device includes a first dielectric layer disposed over a semiconductor substrate, and a first electrode disposed over the first dielectric layer. The semiconductor device also includes a fuse link disposed over the first electrode, and a second electrode disposed over the fuse link. The semiconductor device further includes a third electrode disposed adjacent to the first electrode, and a second dielectric layer separating the first electrode from the first dielectric layer and the third electrode. The first electrode, the fuse link, and the second electrode form a fuse structure, and the first electrode, the third electrode, and a portion of the second dielectric layer between the first electrode and the third electrode form an anti-fuse structure.
Public/Granted literature
- US20220157717A1 SEMICONDUCTOR DEVICE WITH FUSE AND ANTI-FUSE STRUCTURES AND METHOD FOR FORMING THE SAME Public/Granted day:2022-05-19
Information query
IPC分类: