Invention Grant
- Patent Title: Memory device and method of fabricating the memory device
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Application No.: US17401728Application Date: 2021-08-13
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Publication No.: US11522046B2Publication Date: 2022-12-06
- Inventor: Chih-Yu Chang , Sai-Hooi Yeong , Yu-Ming Lin , Chih-Hao Wang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT
- Agent Anthony King
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/66 ; H01L27/11587 ; H01L27/088 ; H01L29/78 ; G11C11/22

Abstract:
The present disclosure provides a semiconductor structure and a method for forming a semiconductor structure. The method for forming a semiconductor structure includes forming a semiconductor stack over a substrate, wherein the semiconductor stack includes a plurality of first semiconductor layers and a plurality of second semiconductor layers alternatively stacked, patterning the semiconductor stack to form a first fin and a second fin adjacent to the first fin, and removing the second semiconductor layers to obtain a first group of nanosheets over the first fin and a second group of nanosheets over the second fin, wherein a lateral spacing between one of the nanosheets in the first group and a corresponding nanosheet in the second group is smaller than a vertical spacing between each of the nanosheets in the first group.
Public/Granted literature
- US20210376080A1 MEMORY DEVICE AND METHOD OF FABRICATING THE MEMORY DEVICE Public/Granted day:2021-12-02
Information query
IPC分类: