Invention Grant
- Patent Title: Semiconductor device with field plate electrode
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Application No.: US17177749Application Date: 2021-02-17
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Publication No.: US11522058B2Publication Date: 2022-12-06
- Inventor: Tsuyoshi Kachi
- Applicant: Kabushiki Kaisha Toshiba , Toshiba Electronic Devices & Storage Corporation
- Applicant Address: JP Tokyo; JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba,Toshiba Electronic Devices & Storage Corporation
- Current Assignee: Kabushiki Kaisha Toshiba,Toshiba Electronic Devices & Storage Corporation
- Current Assignee Address: JP Tokyo; JP Tokyo
- Agency: Allen & Overy LLP
- Priority: JPJP2020-153263 20200911
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L29/78 ; H01L29/06

Abstract:
A semiconductor device includes a first electrode, a first semiconductor layer connected to the first electrode, a second semiconductor layer on the first semiconductor layer, a third semiconductor layer on the second semiconductor layer, a fourth semiconductor layer on the third semiconductor layer, a second electrode connected to the third and fourth semiconductor layers, a gate electrode extending from the fourth toward the second semiconductor layer next to the third semiconductor layer, a field plate electrode extending in a direction from the fourth toward the second semiconductor layer next to the second semiconductor layer, and a first insulating film between the field plate electrode and the second semiconductor layer and having a lower end further from the field plate electrode than the first semiconductor layer; the first, second, and fourth semiconductor layers are of a first conductivity type; and the third semiconductor layer is of a second conductivity type.
Public/Granted literature
- US20220085177A1 SEMICONDUCTOR DEVICE Public/Granted day:2022-03-17
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