Invention Grant
- Patent Title: Field effect transistor, method of fabricating field effect transistor, and electronic device
-
Application No.: US16772742Application Date: 2018-10-17
-
Publication No.: US11522076B2Publication Date: 2022-12-06
- Inventor: Shibo Liang
- Applicant: BEIJING HUA TAN YUAN XIN ELECTRONICS TECHNOLOGY CO., LTD , BEIJING HUATAN TECHNOLOGY CO., LTD
- Applicant Address: CN Beijing; CN Beijing
- Assignee: BEIJING HUA TAN YUAN XIN ELECTRONICS TECHNOLOGY CO., LTD,BEIJING HUATAN TECHNOLOGY CO., LTD
- Current Assignee: BEIJING HUA TAN YUAN XIN ELECTRONICS TECHNOLOGY CO., LTD,BEIJING HUATAN TECHNOLOGY CO., LTD
- Current Assignee Address: CN Beijing; CN Beijing
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: CN201711337902.4 20171214
- International Application: PCT/CN2018/110631 WO 20181017
- International Announcement: WO2019/114408 WO 20190620
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/16 ; H01L29/76 ; H01L21/02

Abstract:
A field effect transistor (FET), a method of fabricating a field effect transistor, and an electronic device, the field effect transistor comprises: a source and a drain, the source being made of a first graphene film; a channel disposed between the source and the drain, and comprising a laminate of a second graphene film and a material layer having semiconductor properties, the second graphene film being formed of bilayer graphene; and a gate disposed on the laminate and electrically insulated from the laminate.
Public/Granted literature
- US20200328294A1 FIELD EFFECT TRANSISTOR, METHOD OF FABRICATING FIELD EFFECT TRANSISTOR, AND ELECTRONIC DEVICE Public/Granted day:2020-10-15
Information query
IPC分类: