Invention Grant
- Patent Title: Epitaxial oxide integrated circuit
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Application No.: US17658506Application Date: 2022-04-08
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Publication No.: US11522087B1Publication Date: 2022-12-06
- Inventor: Petar Atanackovic
- Applicant: Silanna UV Technologies Pte Ltd
- Applicant Address: SG Singapore
- Assignee: Silanna UV Technologies Pte Ltd
- Current Assignee: Silanna UV Technologies Pte Ltd
- Current Assignee Address: SG Singapore
- Agency: MLO, a professional corp.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L29/00 ; H01L23/00 ; H01L29/786 ; H01L21/02 ; H01L23/66 ; H01L29/51 ; H01L29/24

Abstract:
The present disclosure describes epitaxial oxide integrated circuits. In some embodiments, an integrated circuit comprises: a field effect transistor (FET), comprising: a substrate comprising a first oxide material; an epitaxial buried ground plane on the substrate and comprising a second oxide material; an epitaxial buried oxide layer on the epitaxial buried ground plane and comprising a third oxide material; an epitaxial semiconductor layer on the epitaxial buried oxide layer and comprising a fourth oxide material with a first bandgap; a gate layer on the epitaxial semiconductor layer and comprising a fifth oxide material with a second bandgap; electrical contacts; and a waveguide coupled to the field effect transistor. The waveguide can comprise: the epitaxial buried ground plane; the epitaxial buried oxide layer; and a signal conductor, wherein the epitaxial buried oxide layer is between the signal conductor and the epitaxial buried ground plane.
Information query
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