Invention Grant
- Patent Title: Sealing structure and light emitting device
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Application No.: US17236685Application Date: 2021-04-21
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Publication No.: US11522163B2Publication Date: 2022-12-06
- Inventor: Shinichi Tanisako
- Applicant: PIONEER CORPORATION
- Applicant Address: JP Tokyo
- Assignee: PIONEER CORPORATION
- Current Assignee: PIONEER CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Procopio, Cory, Hargreaves & Savitch LLP
- Priority: JPJP2016-043754 20160307
- Main IPC: H01L51/52
- IPC: H01L51/52 ; H01L23/29 ; H01L23/31 ; H05B33/04 ; H01L33/52 ; H01L33/56

Abstract:
A sealing structure (200) seals a light emitting unit (140) and includes a first inorganic film (210), a second inorganic film (220), a first resin-containing film (230), and a second resin-containing film (240). The film thickness of the first inorganic film (210) is equal to or greater than 1 nm and equal to or less than 300 nm. The first resin-containing film (230) is in contact with the first inorganic film (210) and includes a first resin. The second inorganic film (220) is positioned on an opposite side of the first inorganic film (210) with the first resin-containing film (230) interposed between the first and second inorganic films. The second resin-containing film (240) is positioned between the first resin-containing film (230) and the second inorganic film (220) and is in contact with the second inorganic film (220). The second resin-containing film (240) includes a second resin.
Public/Granted literature
- US20210242427A1 SEALING STRUCTURE AND LIGHT EMITTING DEVICE Public/Granted day:2021-08-05
Information query
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