Invention Grant
- Patent Title: Nested housing interface for impedance matching
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Application No.: US17100222Application Date: 2020-11-20
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Publication No.: US11522322B2Publication Date: 2022-12-06
- Inventor: Charles Raymond Gingrich, III , Graham Harry Smith, Jr. , Michael Frank Cina
- Applicant: TE Connectivity Services GmbH
- Applicant Address: CH Schaffhausen
- Assignee: TE Connectivity Services GmbH
- Current Assignee: TE Connectivity Services GmbH
- Current Assignee Address: CH Schaffhausen
- Main IPC: H01R13/6473
- IPC: H01R13/6473 ; H01R13/502 ; H01R13/04

Abstract:
An electrical connector of an electrical connector assembly. The electrical connector includes a housing with a mating face for mating with a mating electrical connector. Contact receiving cavities extend into the housing from the mating face. Contacts are provided in the contact receiving cavities. Mating portions of the contacts extend from the mating face in a direction away from the housing. Protrusions extend from the mating face in a direction away from the housing. The protrusions extend proximate edges of the mating portions of the contacts. The protrusions form reverse chamfers which cooperate with lead-in chamfers provided in a surface of the mating electrical connector. The positioning of the protrusions in the lead-in chamfers fills in air gaps provided by the lead-in chamfers to provide an impedance match along the mating portions of the contacts when the electrical connector is mated with the mating electrical connector.
Public/Granted literature
- US20220166169A1 NESTED HOUSING INTERFACE FOR IMPEDANCE MATCHING Public/Granted day:2022-05-26
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