A dual direction connector interface includes a housing having first and second sides transverse to each other, and first and second dielectric bodies carried in the first and second sides, respectively, which have first and second bores formed therethrough, respectively. A conducting pin is carried within the housing. The conducting pin has a head and a shank. The first and second conductive bodies are carried on the head of the conducting pin and have first and second passages, respectively, formed therein for receiving a center conductor of a coaxial cable. The first and second passages are registered with the first and second bores, respectively.