Invention Grant
- Patent Title: Cover plate for an earpiece, earpiece and method of producing earpiece
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Application No.: US17161542Application Date: 2021-01-28
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Publication No.: US11523235B2Publication Date: 2022-12-06
- Inventor: Andre Ochsenbein , Michael Takacs , Gabriel Perez
- Applicant: SONOVA AG
- Applicant Address: CH Staefa
- Assignee: SONOVA AG
- Current Assignee: SONOVA AG
- Current Assignee Address: CH Staefa
- Agency: ALG Intellectual Property, LLC
- Priority: EP20155132 20200203
- Main IPC: H04R25/00
- IPC: H04R25/00 ; B33Y80/00
Abstract:
The present disclosure relates to a cover plate for covering a lateral opening of a shell of an earpiece configured to be worn at least partially within an ear canal, wherein the cover plate comprises a circumferential trench for receiving an antenna on a medial side of the cover plate, wherein the cover plate comprises a circumferential wall radially outward from the trench and adjacent the wall a surface for gluing the shell on.
Public/Granted literature
- US20210243541A1 Cover Plate for an Earpiece, Earpiece and Method of Producing Earpiece Public/Granted day:2021-08-05
Information query
