Invention Grant
- Patent Title: Conformal memory heatsink
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Application No.: US17224862Application Date: 2021-04-07
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Publication No.: US11523542B2Publication Date: 2022-12-06
- Inventor: Travis Gaskill
- Applicant: Dell Products L.P.
- Applicant Address: US TX Round Rock
- Assignee: Dell Products L.P.
- Current Assignee: Dell Products L.P.
- Current Assignee Address: US TX Round Rock
- Agency: Jackson Walker L.L.P.
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K1/02 ; G06F1/20

Abstract:
An information handling system may include a circuit board that includes a plurality of memory module sockets; a plurality of memory modules received in the plurality of memory module sockets; a plurality of heatsinks disposed between adjacent ones of the plurality of memory modules; and a cold plate having projections that extend into regions between adjacent ones of the plurality of heatsinks.
Public/Granted literature
- US20220330460A1 CONFORMAL MEMORY HEATSINK Public/Granted day:2022-10-13
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