Invention Grant
- Patent Title: Multilayer ceramic electronic component and manufacturing method thereof
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Application No.: US16940777Application Date: 2020-07-28
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Publication No.: US11527359B2Publication Date: 2022-12-13
- Inventor: Hyung Duk Yun , Young Hoon Song , Dong Hwi Shin , Seon Young Yoo , Yu Seop Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2019-0169619 20191218
- Main IPC: H01G4/012
- IPC: H01G4/012 ; H01G4/30 ; H01G4/232 ; H01G4/008

Abstract:
A multilayer ceramic electronic component includes a ceramic body having a capacitance forming portion in which first and second internal electrodes are alternately laminated with respective dielectric layers interposed therebetween, and first and second external electrodes respectively disposed on surfaces of the ceramic body. The first and second internal electrodes are respectively exposed to surfaces of the ceramic body, and first and second protrusions, each including a carbon compound, are respectively disposed on end portions of the first and second internal electrodes exposed to the surfaces of the ceramic body.
Public/Granted literature
- US20210193387A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-06-24
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