Invention Grant
- Patent Title: Method of processing substate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
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Application No.: US16875287Application Date: 2020-05-15
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Publication No.: US11527401B2Publication Date: 2022-12-13
- Inventor: Masayuki Asai , Tomoki Imamura , Kazuyuki Okuda , Yasuhiro Inokuchi , Norikazu Mizuno
- Applicant: KOKUSAI ELECTRIC CORPORATION
- Applicant Address: JP Tokyo
- Assignee: KOKUSAI ELECTRIC CORPORATION
- Current Assignee: KOKUSAI ELECTRIC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Volpe Koenig
- Priority: JPJP2019-093761 20190517
- Main IPC: H01L21/02
- IPC: H01L21/02 ; C23C16/52 ; C23C16/50 ; C23C16/458 ; H01L21/673

Abstract:
There is provided technique including: forming film on substrate by performing cycle, predetermined number of times, including non-simultaneously performing: (a) supplying precursor gas and inert gas to the substrate; and (b) supplying reaction gas to the substrate, wherein in (a), at least one selected from the group of the precursor gas and the inert gas stored in first tank is supplied to the substrate, and at least one selected from the group of the precursor gas and the inert gas stored in second tank is supplied to the substrate, and concentration of the precursor gas in the first tank while at least one selected from the group of the precursor gas and the inert gas is stored in the first tank differs from that in the second tank while at least one selected from the group of the precursor gas and the inert gas is stored in the second tank.
Information query
IPC分类: