Invention Grant
- Patent Title: Semiconductor devices and methods of manufacturing thereof
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Application No.: US17007555Application Date: 2020-08-31
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Publication No.: US11527445B2Publication Date: 2022-12-13
- Inventor: Shu-Uei Jang , Shu-Yuan Ku , Shih-Yao Lin
- Applicant: Taiwan Semiconductor Manufacturing Company Limited
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee Address: TW Hsinchu
- Agency: Foley & Lardner LLP
- Main IPC: H01L29/161
- IPC: H01L29/161 ; H01L29/165 ; H01L21/8234 ; H01L27/088 ; H01L27/092

Abstract:
A semiconductor device includes a first transistor, a second transistor, a third transistor, and a fourth transistor. The first and second transistors operate under a lower gate voltage than the third and fourth transistors. The first transistor has a first active gate structure and the second transistor has a second active gate structure. The first and second active gate structures are separated by a first gate isolation structure along a first direction. The third transistor has a third active gate structure and the fourth transistor has a fourth active gate structure. The third and fourth active gate structures are separated by a second gate isolation structure along the first direction. The variation of a first distance between respective sidewalls of the first gate isolation structure is equal to the variation of a second distance between respective sidewalls of the second gate isolation structure along the first direction.
Public/Granted literature
- US20220068720A1 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF Public/Granted day:2022-03-03
Information query
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