Invention Grant
- Patent Title: Semiconductor apparatus
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Application No.: US17108070Application Date: 2020-12-01
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Publication No.: US11527449B2Publication Date: 2022-12-13
- Inventor: Hiroyuki Nakamura , Kazutoyo Takano
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JPJP2020-097745 20200604
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L29/06

Abstract:
A semiconductor apparatus includes: a semiconductor substrate; a diffusion layer; a first depletion prevention region; a channel stopper electrode, a monitor electrode and an insulating film. The inner edge portion of the monitor electrode is positioned between the diffusion layer and the first depletion prevention region. A distance between the outer edge portion of the channel stopper electrode and the inner edge portion of the monitor electrode is a first distance. A distance between the diffusion layer and the first depletion prevention region is a second distance. The first and second distances are set so that a discharge voltage between the channel stopper electrode and the monitor electrode becomes greater than an avalanche breakdown voltage at a PN junction portion of the diffusion layer and the semiconductor substrate.
Public/Granted literature
- US20210384088A1 SEMICONDUCTOR APPARATUS Public/Granted day:2021-12-09
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