Invention Grant
- Patent Title: Light-emitting module and manufacturing method thereof, and surface-emitting laser
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Application No.: US17023523Application Date: 2020-09-17
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Publication No.: US11527869B2Publication Date: 2022-12-13
- Inventor: Ryosuke Kubota
- Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Osaka
- Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee Address: JP Osaka
- Agency: Oliff PLC
- Priority: JPJP2019-187062 20191010
- Main IPC: H01S5/42
- IPC: H01S5/42 ; H01S5/02253 ; H01S5/02216 ; H01S5/183 ; H01S5/042 ; H01S5/343 ; H01S5/02 ; H01S5/40

Abstract:
A light-emitting module includes a substrate, a first surface-emitting laser mounted on the substrate, the first surface-emitting laser having a first engaging portion protruded outward at an end, and a second surface-emitting laser mounted on the substrate, the second surface-emitting laser having a second engaging portion recessed inward at an end. The first surface-emitting laser and the second surface-emitting laser are adjacent to each other. The first engaging portion and the second engaging portion are engaged with each other.
Public/Granted literature
- US20210111541A1 LIGHT-EMITTING MODULE AND MANUFACTURING METHOD THEREOF, AND SURFACE-EMITTING LASER Public/Granted day:2021-04-15
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