Invention Grant
- Patent Title: Method and device for hole filling of a point cloud
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Application No.: US16753766Application Date: 2018-10-02
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Publication No.: US11532120B2Publication Date: 2022-12-20
- Inventor: Kangying Cai , Joan Llach Pinsach , Celine Guede
- Applicant: InterDigital VC Holdings, Inc.
- Applicant Address: US DE Wilmington
- Assignee: InterDigital VC Holdings, Inc.
- Current Assignee: InterDigital VC Holdings, Inc.
- Current Assignee Address: US DE Wilmington
- Agency: Condo Roccia Koptiw LLP
- Priority: EP17306346 20171006
- International Application: PCT/US2018/053931 WO 20181002
- International Announcement: WO2019/070679 WO 20190411
- Main IPC: G06T17/00
- IPC: G06T17/00 ; G06T7/90
Abstract:
This method for hole filling of a point cloud having at least one hole comprises:—detecting (2) boundary points of the point cloud;—grouping (12) the detected boundary points in boundary regions based on their spatial adjacency;—covering (16) each boundary region with at least one plane; and—inserting (18) new points in the point cloud using the planes covering the boundary regions.
Public/Granted literature
- US20200273241A1 METHOD AND DEVICE FOR HOLE FILLING OF A POINT CLOUD Public/Granted day:2020-08-27
Information query
IPC分类:
| G | 物理 |
| G06 | 计算；推算或计数 |
| G06T | 一般的图像数据处理或产生 |
| G06T17/00 | 用于计算机制图的3D建模 |
