Invention Grant
- Patent Title: Ceramic electronic device, mounting substrate, package body of ceramic electronic device, and manufacturing method of ceramic electronic device
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Application No.: US16796162Application Date: 2020-02-20
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Publication No.: US11532434B2Publication Date: 2022-12-20
- Inventor: Atsushi Imai
- Applicant: TAIYO YUDEN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Chen Yoshimura LLP
- Priority: JPJP2019-031800 20190225
- Main IPC: H01G4/012
- IPC: H01G4/012 ; H01G4/30 ; H01G4/12

Abstract:
A ceramic electronic device includes: a multilayer chip having a multilayer structure and a cover layer, the multilayer structure having a structure in which each of dielectric layers and each of internal electrode layers are alternately stacked, respective one ends of the plurality of internal electrode layers being alternately exposed to a first end face and a second end face of the multilayer structure, the cover layer being provided on each of an upper face and a lower face of the multilayer structure in a stacking direction of the multilayer structure, a main component of the cover layer being ceramic, wherein in each of two side faces of the multiplayer structure, a color of a first region is different from a color of a second region that is positioned at a height different from the first region in the stacking direction.
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