Invention Grant
- Patent Title: Solid state imaging apparatus, production method thereof and electronic device
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Application No.: US17152265Application Date: 2021-01-19
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Publication No.: US11532762B2Publication Date: 2022-12-20
- Inventor: Kyohei Mizuta , Tomokazu Ohchi , Yohei Chiba
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sheridan Ross P.C.
- Priority: JP2013-141762 20130705,JP2014-056608 20140319
- Main IPC: H01L31/0224
- IPC: H01L31/0224 ; H01L27/146 ; H04N5/357 ; H04N5/3745

Abstract:
A solid state imaging apparatus includes an insulation structure formed of an insulation substance penetrating through at least a silicon layer at a light receiving surface side, the insulation structure having a forward tapered shape where a top diameter at an upper portion of the light receiving surface side of the silicon layer is greater than a bottom diameter at a bottom portion of the silicon layer. Also, there are provided a method of producing the solid state imaging apparatus and an electronic device including the solid state imaging apparatus.
Public/Granted literature
- US20210184060A1 SOLID STATE IMAGING APPARATUS, PRODUCTION METHOD THEREOF AND ELECTRONIC DEVICE Public/Granted day:2021-06-17
Information query
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