Invention Grant
- Patent Title: Antenna apparatus and method
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Application No.: US16826538Application Date: 2020-03-23
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Publication No.: US11532868B2Publication Date: 2022-12-20
- Inventor: Lai Wei Chih , Monsen Liu , En-Hsiang Yeh , Chuei-Tang Wang , Chen-Hua Yu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01Q1/22 ; H01L23/00 ; H01L23/66 ; H01L21/48 ; H01L21/56 ; H01L23/48 ; H01L23/498 ; H01L23/522 ; H01Q1/36 ; H01Q9/04
Abstract:
An antenna apparatus comprises a semiconductor die in a molding compound layer, a first through via is between a sidewall of the semiconductor die and a sidewall of the molding compound layer and an antenna structure over the molding compound layer, wherein a first portion of the antenna structure is directly over a top surface of the semiconductor die and a second portion of the antenna structure is directly over a top surface of the first through via.
Public/Granted literature
- US20200220250A1 Antenna Apparatus and Method Public/Granted day:2020-07-09
Information query
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