Invention Grant
- Patent Title: Elastic wave device
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Application No.: US16202382Application Date: 2018-11-28
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Publication No.: US11533038B2Publication Date: 2022-12-20
- Inventor: Daisuke Fukuda
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Keating & Bennett, LLP
- Priority: JPJP2017-243232 20171219,JPJP2018-187860 20181003
- Main IPC: H03H9/02
- IPC: H03H9/02 ; H03H9/10 ; H03H3/08 ; H03H9/145 ; H03H9/25 ; H03H9/64 ; H03H9/05 ; H01L41/047

Abstract:
An elastic wave device includes a substrate, an IDT electrode, a spacer layer, a cover, and a protective layer. The spacer layer is provided on the substrate and surrounds the IDT electrode. The cover is provided on the spacer layer, is spaced apart from the IDT electrode, and includes a first main surface adjacent to the spacer layer and a second main surface facing the first main surface. The protective layer includes a third main surface contacting the second main surface, a fourth main surface facing the third main surface, and a side surface connected to the fourth main surface. In at least portion of the side surface of the protective layer, a portion including an intersection line between the side surface and the fourth main surface is located farther inward than an outer edge of the substrate in plan view in the thickness direction of the substrate.
Public/Granted literature
- US20190190484A1 ELASTIC WAVE DEVICE Public/Granted day:2019-06-20
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