Invention Grant
- Patent Title: High-frequency module, high-frequency circuit, and communication device
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Application No.: US17221310Application Date: 2021-04-02
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Publication No.: US11533806B2Publication Date: 2022-12-20
- Inventor: Hiroshi Matsubara , Masanori Kato , Yukiteru Sugaya , Syunsuke Kido
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JPJP2020-067940 20200403
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11 ; H05K1/18

Abstract:
A filter includes a first input/output electrode and the second input/output electrode, and is arranged on a first main surface of a mounting substrate. The mounting substrate includes a first land electrode, a second land electrode, a ground terminal, and a plurality of via conductors. The first land electrode is connected to the first input/output electrode. The second land electrode is connected to the second input/output electrode. The ground terminal is located closer to a second main surface side than the first main surface in a thickness direction of the mounting substrate. The plurality of via conductors is arranged between the first main surface and the second main surface, and is connected to the ground terminal. The plurality of via conductors is located between the first land electrode and the second land electrode in a plan view from the thickness direction of the mounting substrate.
Public/Granted literature
- US20210315096A1 HIGH-FREQUENCY MODULE, HIGH-FREQUENCY CIRCUIT, AND COMMUNICATION DEVICE Public/Granted day:2021-10-07
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