Invention Grant
- Patent Title: Integral features providing improved flexible printed circuit folding and connection capability
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Application No.: US17120416Application Date: 2020-12-14
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Publication No.: US11533807B2Publication Date: 2022-12-20
- Inventor: David R. Peterson , Joseph Sudik, Jr. , David G. Siegfried , Jared Bilas
- Applicant: APTIV TECHNOLOGIES LIMITED
- Applicant Address: BB St. Michael
- Assignee: APTIV TECHNOLOGIES LIMITED
- Current Assignee: APTIV TECHNOLOGIES LIMITED
- Current Assignee Address: BB St. Michael
- Agency: RMCK Law Group, PLC
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/00

Abstract:
A flexible circuit (FC) and a method of forming the FC each include providing a first dielectric layer, applying a plurality of conductive circuit traces that are substantially parallel to each other to the first dielectric layer, providing a second dielectric layer atop the first dielectric layer and the plurality of conductive circuit traces to form a third dielectric layer having the plurality of conductive traces disposed therein and being configured to support and insulate the plurality of conductive traces, and forming a plurality of channels extending at least partially through a thickness of the third dielectric layer, wherein the plurality of channels are arranged between the plurality of conductive circuit traces and substantially parallel thereto and are configured to provide increased flexibility of the FC.
Public/Granted literature
- US20210212195A1 INTEGRAL FEATURES PROVIDING IMPROVED FLEXIBLE PRINTED CIRCUIT FOLDING AND CONNECTION CAPABILITY Public/Granted day:2021-07-08
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