- Patent Title: Processing order experience data across multiple data structures
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Application No.: US16173002Application Date: 2018-10-29
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Publication No.: US11537970B2Publication Date: 2022-12-27
- Inventor: Aditya Aggarwal , Abhishek Mishra
- Applicant: EMC IP Holding Company LLC
- Applicant Address: US MA Hopkinton
- Assignee: EMC IP Holding Company LLC
- Current Assignee: EMC IP Holding Company LLC
- Current Assignee Address: US MA Hopkinton
- Agency: Ryan, Mason & Lewis, LLP
- Main IPC: G06Q10/06
- IPC: G06Q10/06 ; G06Q30/00 ; G06Q30/02

Abstract:
Methods, apparatus, and processor-readable storage media for processing order experience data across multiple data structures are provided herein. An example computer-implemented method includes processing data, obtained from a first set of data structures, pertaining to orders placed with an enterprise, wherein the first set of data structures contains data associated with distinct portions of order transactions; extracting information pertaining to pre-defined attributes from the processed data and processing the extracted information into a second set of data structures; calculating order experience scores for the orders by applying at least one algorithm to the extracted information in the second set of data structures; generating at least one benchmark order experience value, wherein each benchmark order experience value is based at least in part on the calculated order experience scores; and performing operations related to order experience within the enterprise based at least in part on the benchmark order experience values.
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