Invention Grant
- Patent Title: Semiconductor memory device having insulating layers disposed between a plurality of memory string structures
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Application No.: US17199718Application Date: 2021-03-12
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Publication No.: US11538536B2Publication Date: 2022-12-27
- Inventor: Shingo Nakazawa , Takashi Maeda
- Applicant: Kioxia Corporation
- Applicant Address: JP Tokyo
- Assignee: Kioxia Corporation
- Current Assignee: Kioxia Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JPJP2020-154336 20200915
- Main IPC: G11C16/34
- IPC: G11C16/34 ; G11C16/30 ; G11C16/26 ; G11C16/14

Abstract:
A semiconductor memory device includes first conductive layers arranged in a first direction, second conductive layers arranged in the first direction, a first semiconductor layer disposed therebetween, a charge storage layer, a first wiring electrically connected to the first semiconductor layer, and first and second transistors connected to the first and the second conductive layers. In the semiconductor memory device, in an erase operation, a first voltage is supplied to at least a part of the first conductive layers, an erase voltage larger than the first voltage is supplied to the first wiring, and a first signal voltage is supplied to at least a part of the second transistors. The first signal voltage turns OFF the second transistor.
Public/Granted literature
- US20220084608A1 SEMICONDUCTOR MEMORY DEVICE Public/Granted day:2022-03-17
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