In an electronic cable, a shielding tape prevents and mitigates the creation and propagation of micro-fractures and the deleterious effects thereof. In some embodiments, the shielding tape has layers which are oriented in a non-zero transverse relation with respect to each other, or have been treated to have non-zero orientations. Other embodiments include micro-fracture propagation mitigation means, such as perforations, ridges, waffling, and dimpling. In some embodiments, the layers of the shielding tape are bonded to each other with an electrically-conductive elastomeric adhesive. In other embodiments, the shielding tape is wrapped around a cable's dielectric and form an overlap gap, which is filled by an electrically-conductive elastomeric adhesive.