Invention Grant
- Patent Title: Dielectric material, method of preparing the same, and device comprising the dielectric material
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Application No.: US17368037Application Date: 2021-07-06
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Publication No.: US11538632B2Publication Date: 2022-12-27
- Inventor: Hyeon Cheol Park , Daejin Yang , Doh Won Jung , Taewon Jeong , Giyoung Jo
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2021-0013468 20210129
- Main IPC: H01G4/12
- IPC: H01G4/12 ; H01B3/12 ; H01G4/30 ; H01B19/00
Abstract:
Provided are a dielectric material including a composite represented by Formula 1, a device including the same, and a method of preparing the dielectric material: xAB3.(1−x)(BiaNab)TiO3 [Formula 1] wherein, in Formula 1, A is at least one element selected from among lanthanum group elements, rare earth metal elements, and alkaline earth metal elements, B is at least one element selected from transition metal elements, 0.1
Public/Granted literature
- US20220246353A1 DIELECTRIC MATERIAL, METHOD OF PREPARING THE SAME, AND DEVICE COMPRISING THE DIELECTRIC MATERIAL Public/Granted day:2022-08-04
Information query
