Invention Grant
- Patent Title: Cleave systems having spring members for cleaving a semiconductor structure and methods for cleaving such structures
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Application No.: US17017319Application Date: 2020-09-10
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Publication No.: US11538698B2Publication Date: 2022-12-27
- Inventor: Justin Scott Kayser
- Applicant: GlobalWafers Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: GlobalWafers Co., Ltd.
- Current Assignee: GlobalWafers Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Armstrong Teasdale LLP
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/683 ; H01L21/78
Abstract:
Cleave systems for cleaving a semiconductor structure are disclosed. The cleave systems may include a cleave arm that is moveable from a starting position to a raised position in which a cleave stress is applied to the semiconductor structure. Spring members store energy as the cleave arm is raised with the stored spring energy causing the structure to cleave into two pieces upon initiation of the cleave across the structure.
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Information query
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