Invention Grant
- Patent Title: Flexible and stretchable interconnects for flexible systems
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Application No.: US16965934Application Date: 2019-01-30
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Publication No.: US11538764B2Publication Date: 2022-12-27
- Inventor: Subramanian S. Iyer , Arsalan Alam , Amir Hanna , Takafumi Fukushima
- Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
- Applicant Address: US CA Oakland
- Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
- Current Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
- Current Assignee Address: US CA Oakland
- Agency: Foley & Lardner LLP
- International Application: PCT/US2019/015840 WO 20190130
- International Announcement: WO2019/152512 WO 20190808
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H01L23/538 ; H01L21/48
Abstract:
A flexible device includes: (1) a flexible substrate; and (2) an interconnect disposed over the flexible substrate, wherein the interconnect has a varying vertical displacement along its length, relative to a top surface of the flexible substrate.
Public/Granted literature
- US20210074648A1 FLEXIBLE AND STRETCHABLE INTERCONNECTS FOR FLEXIBLE SYSTEMS Public/Granted day:2021-03-11
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