Invention Grant
- Patent Title: Modular system (switch boards and mid-plane) for supporting 50G or 100G Ethernet speeds of FPGA+SSD
-
Application No.: US17022075Application Date: 2020-09-15
-
Publication No.: US11539537B2Publication Date: 2022-12-27
- Inventor: Sompong Paul Olarig
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Renaissance IP Law Group LLP
- Main IPC: H04L12/04
- IPC: H04L12/04 ; H03K19/173 ; H04L12/44 ; G06F30/331 ; G06F13/40 ; G06F13/38
Abstract:
A chassis front-end is disclosed. The chassis front-end may include a switchboard including an Ethernet switch, a Baseboard Management Controller, and a mid-plane connector. The chassis front-end may also include a mid-plane including at least one storage device connector and a speed logic to inform at least one storage device of an Ethernet speed of the chassis front-end. The Ethernet speeds may vary.
Public/Granted literature
- US11923992B2 Modular system (switch boards and mid-plane) for supporting 50G or 100G Ethernet speeds of FPGA+SSD Public/Granted day:2024-03-05
Information query
