Invention Grant
- Patent Title: Ultrasonic bonding device and ultrasonic bonding method
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Application No.: US16431922Application Date: 2019-06-05
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Publication No.: US11541477B2Publication Date: 2023-01-03
- Inventor: Seijiro Sunaga , Toshinobu Miyagoshi , Mitsuyoshi Makida
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2018-109768 20180607
- Main IPC: B23K20/00
- IPC: B23K20/00 ; G02F1/1345 ; H01L23/00 ; G02F1/13 ; H05K13/00 ; H05K3/36 ; H01L21/607

Abstract:
An ultrasonic bonding device includes a stage and an ultrasonic horn. A first flat member and a second flat member to be bonded are placed on the stage. The ultrasonic horn includes a press part to be pressed on a laminated portion of the first flat member and the second flat member. The stage includes a lower-side surface, a higher-side surface, and a step wall surface. The first flat member is to be placed on the lower-side surface. The higher-side surface is positioned higher than the lower-side surface by a predetermined step height. The second flat member is to be placed on the higher-side surface. The step wall surface is positioned in a boundary between the lower-side surface and the higher-side surface.
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