Invention Grant
- Patent Title: Electronic device packaging box
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Application No.: US17044038Application Date: 2019-04-26
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Publication No.: US11542056B2Publication Date: 2023-01-03
- Inventor: Jihyun Jung , Kwangyoun Kim , Juyeoung Kim , Eunsu Jeong
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Jefferson IP Law, LLP
- Priority: KR10-2018-0049218 20180427
- International Application: PCT/KR2019/005092 WO 20190426
- International Announcement: WO2019/209077 WO 20191031
- Main IPC: B65D5/50
- IPC: B65D5/50 ; B65D85/30 ; H04R1/02 ; H04R1/28

Abstract:
Various embodiments relating to a packaging box for packaging an electronic device are presented, and according to one embodiment, the packaging box comprises: a packaging box body; a receiving part included in the packaging box body and receiving the electronic device; and a support structure received in or removed from the receiving part, at least a portion of the supporting structure able to be slantedly folded to or unfolded, wherein the support structure in a folded state is received, together with the electronic device, in the receiving part to support the electronic device to be able to amplify a sound from a speaker included in the electronic device and, in a state removed from the receiving part or in a state received in the receiving part, the supporting structure cradles the electronic device, and additional various other embodiments are possible.
Public/Granted literature
- US20210094725A1 ELECTRONIC DEVICE PACKAGING BOX Public/Granted day:2021-04-01
Information query
IPC分类: