Invention Grant
- Patent Title: Sealing material and multilayered glass panel using same
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Application No.: US16767473Application Date: 2018-11-01
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Publication No.: US11542192B2Publication Date: 2023-01-03
- Inventor: Takashi Naito , Shinichi Tachizono , Kei Yoshimura , Yuji Hashiba , Hironori Suzuki , Taigo Onodera , Tatsuya Miyake , Akitoyo Konno
- Applicant: Showa Denko Materials Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Showa Denko Materials Co., Ltd.
- Current Assignee: Showa Denko Materials Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Crowell & Moring LLP
- Priority: JPJP2017-227511 20171128
- International Application: PCT/JP2018/040710 WO 20181101
- International Announcement: WO2019/107063 WO 20190606
- Main IPC: C03C8/24
- IPC: C03C8/24 ; B32B17/10 ; C03C8/08 ; C03C27/06 ; E06B3/66 ; E06B3/663 ; E06B3/673 ; E06B3/677

Abstract:
The present invention provides a highly reliable multilayered glass panel and an encapsulating material for achieving the highly reliable multilayered glass panel. The encapsulating material includes lead-free low melting glass particles containing vanadium oxide and tellurium oxide, low thermal expansion filler particles, and glass beads as a solid content. A volume fraction of the glass beads in the solid content is not less than 10% to not more than 35%, and a volume fraction of the lead-free low melting glass particles in the solid content is larger than a volume fraction of the low thermal expansion filler in the solid content.
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