Invention Grant
- Patent Title: Bendable circuit board, expandable circuit board, and electronic device made therefrom
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Application No.: US17283821Application Date: 2019-10-25
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Publication No.: US11542377B2Publication Date: 2023-01-03
- Inventor: Tadahiro Sunaga , Jun Okabe , Shizuo Tokito , Koji Yokosawa
- Applicant: Mitsui Chemicals, Inc.
- Applicant Address: JP Tokyo
- Assignee: Mitsui Chemicals, Inc.
- Current Assignee: Mitsui Chemicals, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Rankin, Hill & Clark LLP
- Priority: JPJP2018-204920 20181031
- International Application: PCT/JP2019/041835 WO 20191025
- International Announcement: WO2020/090634 WO 20200507
- Main IPC: H05K1/18
- IPC: H05K1/18 ; C08J5/18 ; C08G18/75 ; H05K1/02 ; H05K1/03

Abstract:
Provided are an expandable or bendable circuit board having good body-contact feel, strong against bending and folding, and an electronic device made therefrom. The bendable circuit board includes: a film comprising a polyurethane synthesized by reacting a long-chain polyol with polyisocyanate and having a storage modulus at 25° C. of 20 to 200 MPa, a tensile strength of 20 to 80 MPa, and an elongation at break of 500 to 900%, and the temperature of which the storage elastic modulus reaches to 1 MPa is at 155° C. or higher; and circuit wiring formed in contact with a surface of the film. Alternatively, an expandable circuit board having the ratio ρ/ρ0 of the specific electrical resistance ρ of the circuit wiring when the circuit wiring is expanded to the specific electrical resistance (Ω·cm) ρ0 of the circuit wiring before the circuit wiring is expanded is within a range of 1.05 to 10.0.
Public/Granted literature
- US20220002507A1 BENDABLE CIRCUIT BOARD, EXPANDABLE CIRCUIT BOARD, AND ELECTRONIC DEVICE MADE THEREFROM Public/Granted day:2022-01-06
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