Invention Grant
- Patent Title: Epoxy resin composition
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Application No.: US16646963Application Date: 2018-09-12
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Publication No.: US11542418B2Publication Date: 2023-01-03
- Inventor: Kairi Kakutaka , Noriaki Fukuda , Yuhei Funabiki
- Applicant: SUMITOMO SEIKA CHEMICALS CO., LTD.
- Applicant Address: JP Hyogo
- Assignee: SUMITOMO SEIKA CHEMICALS CO., LTD.
- Current Assignee: SUMITOMO SEIKA CHEMICALS CO., LTD.
- Current Assignee Address: JP Hyogo
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Priority: JPJP2017-177800 20170915
- International Application: PCT/JP2018/033726 WO 20180912
- International Announcement: WO2019/054391 WO 20190321
- Main IPC: C08L63/00
- IPC: C08L63/00 ; C09J163/00 ; C09J5/00
Abstract:
There is provided an epoxy resin composition having excellent adhesion to copper and aluminum, and having excellent flexibility in a low-temperature environment. The epoxy resin composition comprises (A) an epoxy resin and (B) a polyamide-based rubber elastomer powder.
Public/Granted literature
- US20200208028A1 EPOXY RESIN COMPOSITION Public/Granted day:2020-07-02
Information query
