Invention Grant
- Patent Title: Physical vapor deposition system and processes
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Application No.: US16801621Application Date: 2020-02-26
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Publication No.: US11542595B2Publication Date: 2023-01-03
- Inventor: Wen Xiao , Vibhu Jindal , Sanjay Bhat
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Servilla Whitney LLC
- Main IPC: C23C14/35
- IPC: C23C14/35 ; H01L21/02 ; C23C14/34
Abstract:
A physical vapor deposition (PVD) chamber and a method of operation thereof are disclosed. Chambers and methods are described that provide a chamber comprising an upper shield with two holes that are positioned to permit alternate sputtering from two targets.
Public/Granted literature
- US20200277696A1 Physical Vapor Deposition System And Processes Public/Granted day:2020-09-03
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