Invention Grant
- Patent Title: Crack identification in IC chip package using encapsulated liquid penetrant contrast agent
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Application No.: US16864536Application Date: 2020-05-01
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Publication No.: US11543322B2Publication Date: 2023-01-03
- Inventor: George K. Parker, IV
- Applicant: GLOBALFOUNDRIES U.S. Inc.
- Applicant Address: US CA Santa Clara
- Assignee: GLOBALFOUNDRIES U.S. Inc.
- Current Assignee: GLOBALFOUNDRIES U.S. Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Hoffman Warnick LLC
- Agent Anthony Canale
- Main IPC: G01M3/22
- IPC: G01M3/22 ; H01L21/54 ; H01L23/22 ; H01L23/26 ; H01L21/56

Abstract:
A packaging fill material for electrical packaging includes a base material, and a plurality of frangible capsules distributed in the base material. Each frangible capsule includes a liquid penetrant contrast agent therein having a different radiopacity than the base material. In response to a crack forming in the packaging fill material, at least one of the plurality of frangible capsules opens, releasing the liquid penetrant contrast agent into the crack. Cracks can be more readily identified in an IC package including the packaging fill material. The liquid penetrant contrast agent may have a radiopacity that is higher than the base material. Inspection can be carried out using electromagnetic analysis using visual inspection or digital analysis of the results to more easily identify cracks.
Public/Granted literature
- US20210341349A1 CRACK IDENTIFICATION IN IC CHIP PACKAGE USING ENCAPSULATED LIQUID PENETRANT CONTRAST AGENT Public/Granted day:2021-11-04
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