Misalignment of a substrate portion which integrates an image sensor and a substrate is suppressed. An imaging apparatus comprises: an imaging optical system including at least one optical element; a holding member holding the imaging optical system; an image sensor configured to capture a subject image formed by the imaging optical system; a substrate having the image sensor mounted thereon; and a bonding member fixing a substrate portion to the holding member, the substrate portion integrating the image sensor and the substrate, wherein the bonding member is partly in contact with a surface of the substrate portion, and at at least two positions in a part of the surface of the substrate portion in contact with the bonding member, the surface of the substrate portion faces different directions.