Invention Grant
- Patent Title: AF module, camera module, and electronic apparatus
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Application No.: US16478090Application Date: 2018-01-16
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Publication No.: US11543621B2Publication Date: 2023-01-03
- Inventor: Munekatsu Fukuyama , Hiroyasu Matsugai , Hiroyuki Itou , Suguru Saito , Keiji Ohshima , Masanori Iwasaki , Toshihiko Hayashi , Shuzo Sato , Nobutoshi Fujii , Hiroshi Tazawa , Toshiaki Shiraiwa , Yusuke Moriya , Minoru Ishida
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: Sheridan Ross P.C.
- Priority: JPJP2017-011993 20170126
- International Application: PCT/JP2018/000936 WO 20180116
- International Announcement: WO2018/139255 WO 20180802
- Main IPC: G02B7/09
- IPC: G02B7/09 ; G02B3/00 ; G02B7/02 ; G02B13/00 ; G03B3/10 ; H01L27/146 ; H04N5/225

Abstract:
There is provided a camera module including a stacked lens structure including a plurality of lens substrates. The plurality of lens substrates includes a first lens substrate including a first lens that is disposed at an inner side of a through-hole formed in the first lens substrate, and a second lens substrate including a second lens that is disposed at an inner side of a through-hole formed in the second lens substrate, wherein the first lens substrate is directly bonded to the second lens substrate. The camera module further includes an electromagnetic drive unit configured to adjust a distance between the stacked lens structure and a light-receiving element.
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