Invention Grant
- Patent Title: Resist composition and method for producing resist pattern, and method for producing plated molded article
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Application No.: US17178794Application Date: 2021-02-18
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Publication No.: US11543749B2Publication Date: 2023-01-03
- Inventor: Masako Sugihara , Takashi Nishimura , Junji Nakanishi
- Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
- Applicant Address: JP Tokyo
- Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
- Current Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Buchanan, Ingersoll & Rooney PC
- Priority: JPJP2020-028862 20200221
- Main IPC: G03F7/023
- IPC: G03F7/023 ; G03F7/022 ; G03F7/30 ; G03F7/039 ; C08F212/14 ; G03F7/038

Abstract:
The present invention provides a resist composition which has sufficient resistant to a plating treatment and is capable of forming a resist pattern with high accuracy. The present invention also provides a method for producing a resist pattern using the resist composition, and a method for producing a plated molded article using the resist pattern. The present invention relates to a resist composition comprising a compound (I) having a quinone diazide sulfonyl group, a resin comprising a structural unit having an acid-labile group (A1), an alkali-soluble resin (A2) and an acid generator (B); a method for producing a resist pattern using the resist composition; and a method for producing a plated molded article using the resist pattern.
Public/Granted literature
Information query
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