Invention Grant
- Patent Title: Method for fabricating electronic package and carrier structure thereof
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Application No.: US17209494Application Date: 2021-03-23
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Publication No.: US11545385B2Publication Date: 2023-01-03
- Inventor: Tse-Yuan Lin , Chun-Ming Laio , Yu-Chih Cheng
- Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Applicant Address: TW Taichung
- Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Current Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Current Assignee Address: TW Taichung
- Agency: Kelly & Kelley, LLP
- Priority: TW10912584 20200721
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/48 ; H01L21/56 ; H01L21/78 ; B32B17/10 ; B32B7/14 ; B32B27/36 ; B32B27/20 ; C08L67/02
Abstract:
A carrier structure having a strengthening layer is provided. The strengthening layer comprises 5 to 30% by weight polysiloxane, 1 to 20% by weight silicon dioxide, and 60 to 85% by weight polyethylene terephthalate (PET) film. The carrier structure is used in a semiconductor packaging process for improving the process reliability.
Public/Granted literature
- US20220028721A1 METHOD FOR FABRICATING ELECTRONIC PACKAGE AND CARRIER STRUCTURE THEREOF Public/Granted day:2022-01-27
Information query
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