Invention Grant
- Patent Title: Package structure and manufacturing method thereof
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Application No.: US16952080Application Date: 2020-11-19
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Publication No.: US11545412B2Publication Date: 2023-01-03
- Inventor: Pei-Wei Wang , Ching Sheng Chen , Ra-Min Tain , Ming-Hao Wu , Hsuan-Wei Chen
- Applicant: Unimicron Technology Corp.
- Applicant Address: TW Taoyuan
- Assignee: Unimicron Technology Corp.
- Current Assignee: Unimicron Technology Corp.
- Current Assignee Address: TW Taoyuan
- Agency: JCIPRNET
- Priority: TW107126005 20180727,TW109137405 20201028
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/373 ; H01L23/498
Abstract:
A package structure including a circuit board and a heat generating element is provided. The circuit board includes a plurality of circuit layers and a composite material layer. A thermal conductivity of the composite material layer is between 450 W/mK and 700 W/mK. The heat generating element is disposed on the circuit board and electrically connected to the circuit layers. Heat generated by the heat generating element is transmitted to an external environment through the composite material layer.
Public/Granted literature
- US20210074606A1 PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-03-11
Information query
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